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Citrini analyst Jukan posted on X, stating that AMD is close to signing a final agreement with Samsung Electronics for the mass supply of HBM4. AMD CEO Lisa Su indicated during the "AMD Advancing AI 2026" event held in San Francisco on June 23 that the two parties are "almost there." AMD has also announced that its "Helios" AI server rack has entered mass production and is scheduled to begin shipping at the end of the third quarter. Samsung Electronics' foundry business president Han Jin-man and DSA head Cho Sang-yeon attended Lisa Su's keynote speech and continued negotiations with AMD executives on the full-scale launch of HBM4 supply.
Odaily News: Citrini analyst jukan posted on X, citing a report from Korean media ETNews, stating that TSMC is building a supply chain for CoPoS materials, components, and equipment, with the goal of achieving mass production next year.
Odaily News: Kostas Chalkias, co-founder and chief cryptographer of Mysten Labs, the development company behind the Sui blockchain, stated that he has leased a dedicated factory at a secret location and plans to scale up production of quantum-safe hardware wallet cards for Sui. The project aims to keep the cost of a single quantum card key under $10, with NFC quantum signing expected to take 1 to 2 seconds. Chalkias noted that the project is being advanced in his personal time outside of work and may include funding to provide cards for users who cannot afford them. The initiative is partly driven by a recent incident involving Coldcard hardware wallets, though the vulnerability was not a quantum attack. Coldcard manufacturer Coinkite disclosed that a firmware vulnerability in Coldcard, traceable to a 2021 update, bypassed the hardware random number chip and generated keys using a predictable software process linked to device serial numbers. Attackers have been moving funds since July 30, with losses climbing to approximately 2,055 BTC, affecting over 7,700 addresses and nearing a value of $130 million. At the protocol level, Sui plans to integrate two quantum-resistant signature schemes approved by the U.S. National Institute of Standards and Technology (NIST), designed for everyday accounts and high-value Move vaults, respectively. Existing accounts can be rotated to quantum-safe keys based on their original recovery phrases, without needing to migrate to new wallets. (Bitcoin.com News)
Telegram founder and CEO Pavel Durov (@durov) revealed in a post that the Russian government has designated him as a "terrorist" because he refused to comply with Russian demands to implement mass surveillance and content censorship on Telegram. Under relevant Russian laws, Durov is prohibited from "publishing any information on the internet." Durov responded to this by stating: "Russian officials obviously fail to understand who can actually kick whom off the internet."
According to TechFlow Research, on July 14, 2026, Nomura Securities released a research report citing data from Japan's Ministry of Economy, Trade and Industry. Japan's packaging substrate shipment value in May reached 27.8 billion yen, a year-on-year increase of 36%, hitting a record high; shipment area increased by 10%, and the average price rose 23% to 1.356 million yen per square meter. The report pointed out that NVIDIA Rubin packaging demand will ramp up this summer (at latest by August), but the variable worth paying more attention to is that Rubin Ultra may shift from a four-die structure to a dual-module structure, as well as the large interposer integration challenges brought by HBM4 wiring upgrades. Intel released EMIB-T technology at ECTC, expected to complete mass production readiness in 2026, capable of integrating up to 12 HBM4 units under an interposer-less solution, with power supply voltage drop improved by 68-80% compared to EMIB; TSMC maintains its lead relying on 3DFabric Alliance and advantages in power delivery and heat dissipation. Nomura Securities believes that the core battlefield of the next-generation packaging competition lies in power delivery, heat dissipation, CPO, and 3D hybrid bonding, and excess returns in the packaging substrate industry will come from the ability to bind to customer technology roadmaps.
Galaxy Digital Head of Research Alex Thorn stated that in 2024 and 2025, a large amount of long-dormant Bitcoin came back online and underwent on-chain transfers, on a scale second only to 2017. He believes this "major distribution" is mostly over, and the number of awoken coins in 2026 is expected to be less than half of last year's.
UBTECH (09880.HK) has launched its full-size, super-bionic humanoid robot, the U1, which features 88 degrees of freedom across its body. The U1 Pro is priced at 169,800 yuan, the U1 Ultra (male and female versions) at 990,000 yuan and 880,000 yuan respectively, and the lightweight, lower-body-only U1 Lite at 119,800 yuan.UBTECH Chairman and CEO Zhou Jian stated that orders for the U1 have exceeded 11,000 units, with a target to complete delivery of these over 10,000 robots this year. (Source: Kan Kan News)Possibly influenced by this news, UBTECH (09880.HK) closed up 7.48%, currently trading around 102 Hong Kong dollars.
Disagrees with View of Massive Unemployment: US Vice President JD Vance stated that some AI company CEOs deliberately hype doomsday theories because fear itself is a form of viral marketing that makes products appear more powerful. He also stated that he does not believe AI will lead to massive unemployment, as there is no relevant evidence in existing data; the more likely outcome is enhanced productivity and changes to certain jobs. This statement addresses the phenomenon of some executives in the AI industry frequently warning about artificial intelligence existential risks.
Odaily Odaily News, Serenity stated that the mass production timeline for the glass substrate industry appears to have been delayed by at least another quarter. Samsung Electro-Mechanics has postponed investments related to semiconductor glass substrates due to bottlenecks in prototype customer reliability evaluations, and recently adjusted its operation start timeline to 2028 during its Q2 earnings call.Additionally, according to a previous TrendForce report, SKC has postponed its glass substrate mass production timeline from the second half of 2026 to the first half of 2027, with plans to complete final verification by the end of this year. Samsung's timeline has also been pushed back from the second half of 2027 to the first half of 2028.Serenity noted that while the timeline delays are not a positive signal, the industry shift toward glass core substrates is still approaching. The capacity ramp-up pace of related manufacturers such as LPK, Philoptics, and E&R may remain in sync with the aforementioned mass production timelines.
Odaily News: Kostas Chalkias, co-founder and chief cryptographer of Mysten Labs, the development company behind the Sui blockchain, stated that he has leased a dedicated factory at a secret location and plans to scale up production of quantum-safe hardware wallet cards for Sui. The project aims to keep the cost of a single quantum card key under $10, with NFC quantum signing expected to take 1 to 2 seconds. Chalkias noted that the project is being advanced in his personal time outside of work and may include funding to provide cards for users who cannot afford them. The initiative is partly driven by a recent incident involving Coldcard hardware wallets, though the vulnerability was not a quantum attack. Coldcard manufacturer Coinkite disclosed that a firmware vulnerability in Coldcard, traceable to a 2021 update, bypassed the hardware random number chip and generated keys using a predictable software process linked to device serial numbers. Attackers have been moving funds since July 30, with losses climbing to approximately 2,055 BTC, affecting over 7,700 addresses and nearing a value of $130 million. At the protocol level, Sui plans to integrate two quantum-resistant signature schemes approved by the U.S. National Institute of Standards and Technology (NIST), designed for everyday accounts and high-value Move vaults, respectively. Existing accounts can be rotated to quantum-safe keys based on their original recovery phrases, without needing to migrate to new wallets. (Bitcoin.com News)
Odaily News: Sony Group and TSMC plan to build a next-generation image sensor semiconductor factory in Kumamoto Prefecture, Japan, as early as 2029, with a total estimated investment of approximately 1 trillion yen (about $6.3 billion). The two companies plan to establish a joint venture for production, with Sony holding about 60% and TSMC holding about 40%. (Nikkei)
Odaily News, Alliance co-founder Imran stated on X that the competition between Pump and Fomo could become a major driving force in bringing onchain finance into the mainstream market. The rivalry between the two platforms will push onchain finance from a niche segment of the current Crypto Twitter ecosystem into a product for mass consumers.Imran also noted that with the growth of trading-focused content creators, as well as the rise of trading-related content such as Market Bubble and Counterparty, the onchain finance industry could expand by at least an order of magnitude in the future.Previous report: pump.fun is attracting users to migrate from the FOMO platform to its application through an incentive program. According to its disclosed protocol documents, pump.fun plans to offer eligible users a one-time $20,000 signing bonus and a fixed monthly compensation of $30,000.
According to Nikkei Cross Tech, AMD Chair and CEO Lisa Su announced that the rack-scale computer "Helios" for AI data centers has officially entered mass production. Compared to Nvidia's latest AI rack, Helios can process up to 30% more tokens per dollar, demonstrating significant performance advantages. It is reported that the MPU equipped in Helios is manufactured using TSMC's 2nm process technology.