Samsung will jointly produce Nvidia's next-generation custom HBM with TSMC, with the substrate chip manufactured using a 3nm process.
Source：
www.sedaily.com
According to The Korea Economic Daily, Samsung Electronics will use TSMC’s 3nm process to manufacture the core component, Base Die, when developing NVIDIA’s next-generation custom high-bandwidth memory, NVHBM. NVIDIA has also required Samsung, SK hynix, and Micron to uniformly adopt TSMC’s 3nm Base Die and standardize the Core Die using the sixth-generation DRAM 1c process to improve product consistency across different suppliers.
