Netease-incubated Qianheyibang successfully powered on the world's first 4-layer 3D DRAM stacked compute-in-memory chip

Qianhe Yibang, a 3D computing-in-memory chip company, announced that its self-developed world's first 4-layer 3D DRAM-stacked computing-in-memory chip has been successfully fabricated and powered on, marking the technology's transition from validation to engineering implementation. The chip employs a three-dimensional integrated native computing architecture, delivering a data memory access bandwidth that is an order of magnitude greater than conventional approaches. Memory access power consumption, latency, and per-processing costs are all reduced by an order of magnitude. Founded in January 2024 and incubated by NetEase, Qianhe Yibang recently closed a Series B funding round exceeding 2 billion yuan.